1 / 2 www.asb.co.kr september 2008 p lerow tm aln50 - 1000at internally matched lna module parameter unit specifications min typ max min typ max min typ max frequency range mhz 50 ~ 300 300 ~ 600 600 ~ 1000 gain db 15 16 15 16 14.5 15.5 gain flatness db ? 0.1 ? 0.15 ? 0.1 ? 0.15 ? 0.2 ? 0.3 noise figure d b 2.0 2.05 2.1 2.05 2.2 2.25 output ip3 (1) dbm 38 39 38 39 35 36 s11 / s22 (2) db - 15 / - 10 - 12 / - 14 - 11 / - 11 output p1db dbm 20 21 20 21 19 20 switching time (3) sec - supply current ma 90 (typ) 110 (max) supply voltage v 5 impedance ? 75 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h note: operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 5 dbm / tone separated by 6 mhz. 2) s11/s22 (max) is the worst value within the frequency band. recommended is the vswr toward the source and the load less than 4:1 respectively to be free from any oscillation, which may result from the devices ahead or behind in its system applic a tion even though it may be unconditionally stable (k factor >1). 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to 5 v. pin number function 2 rf in 5 rf out 6 +v cc other s ground (recommended footprint) the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastruc ture equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stab ility factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other co mponents necessary just in case allows very simple and convenient implementation onto the system board in mass production level. ou t line drawing (unit: mm) feature s 16 db gain at 50 mhz 15.5 db gain at 1000 mhz 2.2 db nf(max) over frequency 21 dbm p1db, 40 dbm oip3 @ 5v / 90ma - ? sec swtiching time(max) specifications note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding cons ider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description aln50 - 1000at asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area @ t = 25 ? c, v cc = 5 v, freq. = 50 ~ 1000 mhz, 75 ohm c o u pl er website: www.asb .co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 1 - stage single type
2 / 2 www.asb.co.kr september 2008 p lerow tm aln50 - 1000at internally matched lna module s - param e ters noise figure oip3 p1db catv 50~1000 mhz +5 v stability fa c tor (k) typical performance (measured)
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